DESCRIPTION
/FEATURES
Typical applications are in switching power supplies, converters, free-wheeling diodes, and reverse battery protection. Low profile, axial leaded outline High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance Very low forward voltage drop High frequency operation Guard ring for enhanced ruggedness and long term reliability Lead-Free plating CASE STYLE AND DIMENSIONS Device Marking: 1N581X Conform to JEDEC Outline DO-204AL (DO-41) Dimensions in millimeters and inches 1 1N5818, 1N5819 Bulletin PD-20590 r