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IRFR4105PbF Datasheet PDF

International Rectifier IRFR4105PbF

This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.
Part No. IRFR4105PbF
Datasheet IRFR4105PbF Download
Manufacturer
International Rectifier
Description Power MOSFET
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IRFR4105PbF datasheet page 1 preview

DESCRIPTION

l HEXFET® Power MOSFET D VDSS = 55V G S RDS(on) = 0.045Ω ID = 27A Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. The straight lead version (IRFU series) is for throughhole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications. D-PAK TO-252AA I-PAK TO-251AA

ABSOLUTE MAXIMUM RATINGS

Parameter ID @ T C = 25°C ID @ T C = 100°C IDM PD @TC = 25°C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current, V GS @ 10V Continuous Drain Current, V GS @ 10V Pulsed Drain Current ‡ Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy ‚‡ Avalanche Current ‡ Repetitive Avalanche Energy ‡ Peak Diode Recovery dv/dt ƒ Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Max. 27 19 100 68 0.45 ± 20 65 16 6.8 5.0 -55 to + 175 300 (1.6mm from case ) Units...
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