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IXGA16N60B2 - HiPerFAST IGBT

Key Features

  • z Maximum Lead Temperature for Soldering 1.6mm (0.062 in. ) from Case for 10s TO-263 TO-220 z z Optimized for Low Conduction and Switching Losses Square RBSOA International Standard Packages Advantages z z High Power Density Low Gate Drive Requirement.

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Other Datasheets by IXYS (now Littelfuse)

Part Number Description
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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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HiPerFASTTM IGBTs B2-Class High Speed IXGA16N60B2 IXGP16N60B2 VCES = IC110 = VCE(sat) ≤ tfi(typ) = 600V 16A 2.3V 70ns TO-263 AA (IXGA) Symbol VCES VCGR VGES VGEM IC25 IC110 ICM SSOA (RBSOA) PC TJ TJM Tstg Md FC TL TSOLD Weight www.DataSheet4U.net Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C, RGE = 1MΩ Continuous Transient TC = 25°C TC = 110°C TC = 25°C, 1ms VGE = 15V, TJ = 125°C, RG = 22Ω Clamped Inductive load TC = 25°C Maximum Ratings 600 600 ±20 ±30 40 16 100 ICM = 32 VCE ≤ VCES 150 -55 ... +150 150 -55 ... +150 V V V V A A A A W °C °C °C Nm/lb.in. N/lb. °C °C g g G E C (Tab) TO-220AB (IXGP) G CE C (Tab) G = Gate E = Emitter C = Collector Tab = Collector Mounting Torque (TO-220) Mounting Force (TO-263) 1.13/10 10..65 / 2.2..14.6 300 260 2.5 3.