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IXGH32N50B - HiPerFAST IGBT

Features

  • l G E C (TAB) TO-247 AD C (TAB) G C E C = Collector, TAB = Collector G = Gate, E = Emitter, Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md Weight Mounting torque (M3) 1.13/10 Nm/lb. in. TO-247 AD TO-247 SMD 6 4 g g l l l International standard packages JEDEC TO-247 SMD surface mountable and JEDEC TO-247 AD High current handling capability Newest generation.

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Datasheet Details

Part number IXGH32N50B
Manufacturer IXYS Corporation
File Size 71.39 KB
Description HiPerFAST IGBT
Datasheet download datasheet IXGH32N50B Datasheet
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Preliminary Data Sheet HiPerFASTTM IGBT IXGH32N50B VCES IXGH32N50BS I C25 VCE(sat) tfi TO-247 SMD (32N50BS) = = = = 500 V 60 A 2.0 V 80 ns www.DataSheet4U.com Symbol VCES VCGR V GES V GEM I C25 I C90 I CM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25°C TC = 90°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125° C, RG = 33 Ω Clamped inductive load, L = 100 µH TC = 25°C Maximum Ratings 500 500 ±20 ±30 60 32 120 ICM = 64 @ 0.8 VCES 200 -55 ... +150 150 -55 ... +150 300 V V V V A A A A W °C °C °C °C Features l G E C (TAB) TO-247 AD C (TAB) G C E C = Collector, TAB = Collector G = Gate, E = Emitter, Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Md Weight Mounting torque (M3) 1.
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