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IXGH72N60C3 - GenX3 600V IGBT

Features

  • z z z z Maximum Lead Temperature for Soldering 1.6 mm (0.062in. ) from Case for 10s Mounting Torque 300 260 1.13/10 6 Optimized for Low Switching Losses Square RBSOA Avalanche Rated International Standard Package Advantages z z High Power Density Low Gate Drive Requirement Symbol Test Conditions (TJ = 25°C, Unless Otherwise Specified) BVCES VGE(th) ICES IGES VCE(sat) IC IC = 250μA, VGE = 0V = 250μA, VCE = VGE TJ = 125°C Characteristic Values Min. Typ. Max. 600 3.0 5.5 V V.

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www.DataSheet.co.kr GenX3TM 600V IGBT IXGH72N60C3 High-Speed PT IGBT for 40-100kHz Switching VCES IC110 VCE(sat) tfi (typ) = = ≤ = 600V 72A 2.5V 55ns Symbol VCES VCGR VGES VGEM IC25 IC110 ICM IA EAS SSOA (RBSOA) PC TJ TJM Tstg TL TSOLD Md Weight Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C, RGE = 1MΩ Continuous Transient TC = 25°C (Limited by Leads) TC = 110°C (Chip Capability) TC = 25°C, 1ms TC = 25°C TC = 25°C VGE = 15V, TVJ = 125°C, RG = 2Ω Clamped Inductive Load TC = 25°C Maximum Ratings 600 600 ±20 ±30 75 72 360 50 500 ICM = 150 VCE ≤ VCES 540 -55 ... +150 150 -55 ... +150 V V V V A A A A mJ A W °C °C °C °C °C Nm/lb.in. g TO-247 AD G C E Tab G = Gate E = Emitter C = Collector Tab = Collector Features z z z z Maximum Lead Temperature for Soldering 1.6 mm (0.
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