Click to expand full text
X3-Class HiPerFETTM Power MOSFET
N-Channel Enhancement Mode Avalanche Rated
IXFA56N30X3 IXFP56N30X3 IXFH56N30X3
D
G S
Symbol
VDSS VDGR VGSS VGSM ID25 IDM IA EAS dv/dt
PD TJ TJM Tstg TL TSOLD FC Md Weight
Test Conditions TJ = 25C to 150C TJ = 25C to 150C, RGS = 1M Continuous Transient
Maximum Ratings
300
V
300
V
20
V
30
V
TC = 25C TC = 25C, Pulse Width Limited by TJM TC = 25C TC = 25C IS IDM, VDD VDSS, TJ 150°C TC = 25C
56 112
28 700
50 320 -55 ... +150 150 -55 ... +150
A A
A mJ V/ns
W C C C
Maximum Lead Temperature for Soldering
300
°C
1.6 mm (0.062in.) from Case for 10s
260
°C
Mounting Force (TO-263)
10..65 / 2.2..14.6
Mounting Torque (TO-220 & TO-247)
1.13 / 10
N/lb Nm/lb.in
TO-263 TO-220 TO-247
2.5
g
3.0
g
6.
IXFH56N30X3 Datasheet
