IXGR72N60C3 Overview
Key Specifications
Mount Type: Through Hole
Max Operating Temp: 150 °C
Min Operating Temp: -55 °C
Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Optimized for Low Switching Losses W
- Square RBSOA
- Isolated Mounting Surface °C
- Avalanche Rated °C
- 2500V Electrical Isolation °C °C Advantages °C V~
- High Power Density
- Low Gate Drive Requirement N/lb g Applications
- High Frequency Power Inverters Symbol Test Conditions Characteristic Values
- UPS (TJ = 25°C, Unless Otherwise Specified) Min. Typ. Max
