MMIX1F230N20T Overview
Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Substrate
- Excellent Thermal Transfer
- Increased Temperature and Power Cycling Capability
- High Isolation Voltage (2500V~)
- 175°C Operating Temperature
- Very High Current Handling Capability
- Fast Intrinsic Diode
- Avalanche Rated
- Very Low RDS(on) Advantages
