IDV02S60C Overview
The second generation of Infineon SiC Schottky diodes has emerged over the years as the industry standard. The IDVxxS60C family is extending the already broad portfolio with the TO220FullPAK package. In order to greatly reduce the impact of the internal isolation of the FullPAK on the thermal performance, Infineon is applying its patented diffusion soldering process for attaching the chip to the leadframe.
IDV02S60C Key Features
- Revolutionary semiconductor material
- Silicon Carbide Nearly no reverse / forward recovery charge High surge current capability Fully isolated package with ne