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SIGC07T60NC
IGBT Chip in NPT-technology
FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling
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This chip is used for: • IGBT-Modules Applications: • drives
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Chip Type SIGC07T60NC
VCE 600V
ICn 6A
Die Size 2.6 x 2.6 mm2
Package sawn on foil
Ordering Code Q67050-A4134A001
MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 2.6 x 2.6 6.76 / 4.3 1.11 x 1.78 0.5 x 0.
SIGC07T60NC Datasheet
