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SIGC07T60UN
High Speed IGBT Chip in NPT-technology
FEATURES:
• low Eoff • 600V NPT technology • 100µm chip • short circuit prove • positive temperature coefficient • easy paralleling
This chip is used for: • SKB06N60HS
Applications: • Welding • PFC • UPS
C G
E
Chip Type SIGC07T60UN
VCE
ICn
600V 6A
Die Size 2.6 x 2.6 mm2
Package Ordering Code
sawn on foil
Q67050-A4220A101
MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization
Collector metallization
Die bond Wire bond Reject Ink Dot Size
Recommended Storage Environment
2.6 x 2.6
mm2
6.8 / 4.1
1.78 x 1.1
0.499 x 0.
SIGC07T60UN Datasheet
