SIGC25T60UN Datasheet | Infineon

.. High Speed IGBT Chip in NPT-technology Features : - - - - - - low Eoff 600V NPT technology 100µm chip short circuit prove positive temperature coefficient easy paralleling This chip is used for: - SGP30N60HS Applications: - Welding - PFC - UPS Chip Type SIGC25T60UN VCE 600V ICn 30A Die Size 4.5 x 5.71 mm2 Package sawn on foil Ordering Code Q67041-A4667A001 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 4.5...