Click to expand full text
www.DataSheet4U.com
SIGC42T170R3
IGBT Chip
FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
3
This chip is used for: • power module
C
Applications: • drives
G
E
Chip Type SIGC42T170R3
VCE 1700V
ICn 29A
Die Size 6.5 x 6.46 mm2
Package sawn on foil
Ordering Code Q67050A4151-A001
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 6.5 x 6.46 4.27 x 4.27 1.18 x 1.09 42 / 28.
SIGC42T170R3 Datasheet
