Infineon Technologies BGF112
BGF112 is an ESD protection circuit and EMI filtering device for an AV I/F interface for mobile applications. The external pins are protected against ESD pulses of 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only 0.76 mm x 1.16 mm and a total height of 0.6 mm Int.| Part No. | BGF112 |
|---|---|
| Datasheet | BGF112 Download |
| Manufacturer |  Infineon Technologies |
| Description | AV I/F Device |
| Buy | Stock & Price |
FEATURES
● ESD protection circuit and filter for AV I/F interface● Integrated ESD protection at external pins of 15 kV contact discharge according to IEC61000-4-2
● Wafer level package with SnAgCu solder balls
● RoHS and WEEE compliant package
● 400 µm solder ball pitch WLP-5-1
DESCRIPTION
IOs A1 R1, 15 Ω Ext . IOs A2 C1 R2, 15 Ω C2 C1, 5nF C2, 5nF GND, B2 BGF 112_schematic.vsd Figure 1 Type BGF112 Table 1 Parameter Schematic Package WLP-5-1MAXIMUM RATINGS
Symbol Min. Values Typ. – – – – – – Max. 4 +85 +150 70 15 2 V °C °C mW kV kV 0 -40 -65 – -15 -2 Unit Note / Test Condition – – – Marking 112 Chip N0736 Voltage at all pins to GND Operating temperature range Storage temperature range Power dissipation each line Contact discharge from A2 or C2 to GND Contact discharge between all other pins VP TOP TSTG Pin VESD VESD TS < 70 °C – – Electrostatic Discharge According to IEC61000-4-2 Data Sheet 4 V3.0, 2008-11-19 Datasheet pdf - BGF112 AV I/F Device with ESD Protection BGF112 Table 2 Parameter Electrical Characteristics1) Symbol Min.
