BGF112 Description
BGF112 is an ESD protection circuit and EMI filtering device for an AV I/F interface for mobile applications. The external pins are protected against ESD pulses of 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only 0.76 mm x 1.16 mm and a total height of 0.6 mm Int.
BGF112 Key Features
- ESD protection circuit and filter for AV I/F interface
- Integrated ESD protection at external pins of 15 kV contact discharge according to IEC61000-4-2
- Wafer level package with SnAgCu solder balls
- RoHS and WEEE pliant package
- 400 µm solder ball pitch