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CYW20835 Datasheet Bluetooth Le System On Chip

Manufacturer: Infineon

Overview: CYW20835 AIROC™ Bluetooth® LE system on chip General.

General Description

The Infineon AIROC™ CYW20835 Bluetooth® LE SoC is a Bluetooth® 5.4 core spec pliant device for IoT applications.

Manufactured using the industry’s advanced 40-nm CMOS low-power process, the CYW20835 employs high levels of integration to minimize external ponents, reducing the device footprint and the costs associated with implementing Bluetooth® Low Energy solutions.

CYW20835 Bluetooth® LE SoC is designed to support the wide spectrum of Bluetooth® Low Energy use cases for home automation, accessory, sensors (medical, home, security, and industrial), lighting, Bluetooth® mesh, wireless input devices, and remote controls, or any Bluetooth® LE connected IoT application.

Key Features

  • Bluetooth® subsystem - Complies with Bluetooth® core specification v5.4 with LE 2-Mbps support - Bluetooth® Low Energy - Supports Adaptive Frequency Hopping (AFH) - Programmable TX power up to 12 dBm - Rx sensitivity.
  • 94.5 dBm (Bluetooth® LE) - Ultra-low-power radio.
  • RX current 8 mA.
  • TX current 18 mA at 12 dBm.
  • Coexistence support - Support for global coexistence interface for easy coexistence implementation with select Infineon AIROC™ Wi-Fi devices.

CYW20835 Distributor