DF11MR12W1M1P_B11 Overview
DF11MR12W1M1P_B11 EasyPACK™ModulmitCoolSiC™TrenchMOSFETundPressFIT/NTC/TIM EasyPACK™modulewithCoolSiC™TrenchMOSFETandPressFIT/NTC/TIM VorläufigeDaten/PreliminaryData PotentielleAnwendungen SolarAnwendungen ElektrischeEigenschaften HoheStromdichte NiederinduktivesDesign MechanischeEigenschaften IntegrierterNTCTemperaturSensor PressFITVerbindungstechnik Robuste Montage durch...
DF11MR12W1M1P_B11 Key Features
- Highcurrentdensity
- Lowinductivedesign
- IntegratedNTCtemperaturesensor
- PressFITcontacttechnology
- Rugged mounting due to integrated mounting
- Pre-appliedThermalInterfaceMaterial
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