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FF08MR12W1MA1_B11A - a half bridge module

Datasheet Summary

Description

The Automotive CoolSiCTM EasyPACKTM1B is a half bridge module which combines the benefits of Infineon’s robust silicon carbide technology with a very compact and flexible package for hybrid and (fuel cell) electric vehicles.

Features

  • Electrical features - VDSS = 1200 V - IDN = 150 A - New semiconductor material - silicon carbide - Blocking voltage 1200 V - Low RDS,on - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 150°C.
  • Mechanical features - 5.1 kV DC 1 second Insulation - Compact design - High power density - Integrated NTC temperature sensor - PressFIT contact technology - RoHS compliant Potential.

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Datasheet preview – FF08MR12W1MA1_B11A

Datasheet Details

Part number FF08MR12W1MA1_B11A
Manufacturer Infineon
File Size 587.85 KB
Description a half bridge module
Datasheet download datasheet FF08MR12W1MA1_B11A Datasheet
Additional preview pages of the FF08MR12W1MA1_B11A datasheet.

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Full PDF Text Transcription

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FF08MR12W1MA1_B11A EasyPACK™ module EasyPACK™ module with CoolSiC™ Automotive MOSFET and PressFIT / NTC Features • Electrical features - VDSS = 1200 V - IDN = 150 A - New semiconductor material - silicon carbide - Blocking voltage 1200 V - Low RDS,on - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 150°C • Mechanical features - 5.1 kV DC 1 second Insulation - Compact design - High power density - Integrated NTC temperature sensor - PressFIT contact technology - RoHS compliant Potential applications • Automotive applications • Auxiliary inverters • DC/DC converter • (Hybrid) electrical vehicles (H)EV Product validation • Qualified according to AQG 324, release no.: 02.
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