Datasheet Details
| Part number | FF08MR12W1MA1_B11A |
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| Manufacturer | Infineon |
| File Size | 587.85 KB |
| Description | a half bridge module |
| Datasheet |
 FF08MR12W1MA1_B11A Datasheet
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General Description
The Automotive CoolSiCTM EasyPACKTM1B is a half bridge module which combines the benefits of Infineon’s robust silicon carbide technology with a very compact and flexible package for hybrid and (fuel cell) electric vehicles.
Key Features
- Electrical features - VDSS = 1200 V - IDN = 150 A - New semiconductor material - silicon carbide - Blocking voltage 1200 V - Low RDS,on - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 150°C.
- Mechanical features - 5.1 kV DC 1 second Insulation - Compact design - High power density - Integrated NTC temperature sensor - PressFIT contact technology - RoHS compliant Potential.