FF08MR12W1MA1_B11A Description
The Automotive CoolSiCTM EasyPACKTM1B is a half bridge module which bines the benefits of Infineon’s robust silicon carbide technology with a very pact and flexible package for hybrid and (fuel cell) electric vehicles. The power module implements the new CoolSiCTM Automotive MOSFET 1200V Gen1, optimized for high voltage applications like DC/DC converter and Auxiliary inverter. The chipset offers benchmark current...
FF08MR12W1MA1_B11A Key Features
- Electrical features
- VDSS = 1200 V
- IDN = 150 A
- New semiconductor material
- silicon carbide
- Blocking voltage 1200 V
- Low RDS,on
- Low switching losses
- Low Qg and Crss
- Low inductive design