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FF08MR12W1MA1_B11A Datasheet A Half Bridge Module

Manufacturer: Infineon

Overview: FF08MR12W1MA1_B11A EasyPACK™ module EasyPACK™ module with CoolSiC™ Automotive MOSFET and PressFIT /.

General Description

The Automotive CoolSiCTM EasyPACKTM1B is a half bridge module which bines the benefits of Infineon’s robust silicon carbide technology with a very pact and flexible package for hybrid and (fuel cell) electric vehicles.

The power module implements the new CoolSiCTM Automotive MOSFET 1200V Gen1, optimized for high voltage applications like DC/DC converter and Auxiliary inverter.

The chipset offers benchmark current density, high block voltage and reduced switching losses, which allows pact designs and helps to improve system efficiency, as well as allows a reliable operation under harsh environmental conditions.

Key Features

  • Electrical features - VDSS = 1200 V - IDN = 150 A - New semiconductor material - silicon carbide - Blocking voltage 1200 V - Low RDS,on - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 150°C.
  • Mechanical features - 5.1 kV DC 1 second Insulation - Compact design - High power density - Integrated NTC temperature sensor - PressFIT contact technology - RoHS compliant Potential.

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