Click to expand full text
SIDC14D120H8
Fast switching diode chip in Emitter Controlled Technology
Features:
Recommended for:
A
1200V technology 120 µm chip
power modules and discrete
soft, fast switching
devices
low reverse recovery charge
small temperature coefficient
C
qualified according to JEDEC for target
Applications:
applications
SMPS, resonant applications,
drives
Chip Type SIDC14D120H8
VR
IFn
1200V 25A
Die Size 3.8 x 3.8 mm2
Package sawn on foil
Mechanical Parameters Die size Area total Anode pad size Thickness Wafer size Max. possible chips per wafer Passivation frontside Pad metal
Backside metal
3.8 x 3.8 14.44
mm2
3.08 x 3.