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SIDC26D60C8
Fast switching diode chip in Emitter Controlled 3 -Technology
A
Features:
This chip is used for:
• 600V Emitter Controlled 3 technology
• Power module
70 µm chip
• soft, fast switching
C
• low reverse recovery charge • small temperature coefficient
Applications: • Drives
Chip Type SIDC26D60C8
VR
IF
600V 100A
Die Size 6.53 x 4.02 mm2
Package sawn on foil
Mechanical Parameters Raster size Area total Anode pad size Thickness Wafer size Max. possible chips per wafer Passivation frontside Pad metal
Backside metal
Die bond Wire bond Reject ink dot size
Recommended storage environment
6.53 x 4.02 26.25
mm2
5.83 x 3.
SIDC26D60C8 Datasheet
