SIDC30D120F6 Datasheet | Infineon

Preliminary Fast switching diode chip in EMCON-Technology Features : - 1200V EMCON technology 120 µm chip - soft, fast switching This chip is used for: - EUPEC power modules and discrete devices - low reverse recovery charge - small temperature coefficient Applications: - SMPS, resonant applications, drives Chip Type SIDC30D120F6 Die Size 1200V 35A 5.5 x 5.5 mm2 Package Ordering Code sawn on foil Q67050-A4184A001 MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallisation Cathode metallisation Die bond Wire bond Reject Ink Dot...