SIGC05T60SNC Datasheet | Infineon

FEATURES : - 600V NPT technology - 100µm chip - short circuit prove - positive temperature coefficient - easy paralleling This chip is used for: - Duo Pack SGP04N60 Applications: - drives Chip Type SIGC05T60SNC ICn 600V 4A Die Size 2.29 x 2.29 mm2 Package Ordering Code sawn on foil Q67050-A4149A101 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 2.29 x 2.29 mm2 5.2 / 3.2 1.38 x 0.93 0.7 x 0.5 µm 150 mm 180 deg Photoimide 3200 nm Al Si 1% 1400 nm Ni Ag - system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al,≤500µm ∅ 0.65mm ; max 1.2mm store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C Edited by INFINEON Technologies AI PS DD HV3, L7202-S, Edition 2, 28.11.2003 MAXIMUM...