• Part: SIGC11T60SNC
  • Description: IGBT
  • Manufacturer: Infineon
  • Size: 76.20 KB
Download SIGC11T60SNC Datasheet PDF
Infineon
SIGC11T60SNC
SIGC11T60SNC is IGBT manufactured by Infineon.
IGBT Chip in NPT-technology Features : - 600V NPT technology - 100µm chip - positive temperature coefficient - easy paralleling This chip is used for: - IGBT Modules Applications: - drives Chip Type SIGC11T60SNC ICn Die Size 600V 10A 3.25 x 3.25 mm2 Package Ordering Code sawn on foil Q67050-A4155A001 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 3.25 x 3.25 mm2 10.56 / 7.4 2 x 1.6 1.08 x 0.68 µm 150...