IRFBC20L Overview
Key Specifications
Package: TO-262-3
Mount Type: Through Hole
Height: 9.65 mm
Length: 10.67 mm
Description
Third generation HEXFETs from international Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2Pak is a surface mount power package capable ofthe accommodatingdie sizes up to HEX-4.