Download IRFR3706PbF Datasheet PDF
IRFR3706PbF page 2
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IRFR3706PbF Description

20 ± 12 75 „ 53 „ 280 88 44 0.59 -55 to + 175 RθJC RθJA RθJA Parameter Junction-to-Case Junction-to-Ambient (PCB mount) Junction-to-Ambient Typ. When mounted on 1" square PCB (FR-4 or G-10 Material) . For remended footprint and soldering techniques refer to application note #AN-994 Max.

IRFR3706PbF Key Features

  • High Frequency Isolated DC-DC Converters with Synchronous Rectification for Tele and Industrial Use
  • High Frequency Buck Converters for puter Processor Power
  • Lead-Free HEXFET® Power MOSFET VDSS 20V RDS(on) max 9.0mΩ ID 75A„ Benefits
  • Ultra-Low Gate Impedance
  • Very Low RDS(on) at 4.5V VGS
  • Fully Characterized Avalanche Voltage and Current D-Pak IRFR3706 I-Pak IRFU3706