IRF7738L2PBF Description
The IRF7738L2TR(1)PbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging to achieve the lowest onstate resistance in a package that has the footprint of a DPak (TO-252AA) and only 0.7 mm profile. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,...
IRF7738L2PBF Key Features
- Advanced Process Technology
- Optimized for Motor Drive, DC-DC and