C0805C104M5UAC Overview
KEMET ® CERAMIC CHIP/STANDARD ELECTRODES L B TIN PLATE NICKEL PLATE CONDUCTIVE METALLIZATION DIMENSIONS—MILLIMETERS AND (INCHES) 0.3 (.012) 0.7 (.028) 0.75 (.030) N/A N/A N/A N/A N/A N/A MOUNTING TECHNIQUE Solder Reflow Solder Wave or Solder Reflow Solder Reflow * Note: Indicates EIA Preferred Case Sizes # Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette. CAPACITOR ORDERING INFORMATION (Standard Chips - For C 0805 C 103 K 5 R A C*
C0805C104M5UAC Key Features
- C0G (NP0), X7R, Z5U and Y5V Dielectrics
- 10, 16, 25, 50, 100 and 200 Volts
- Standard End Metalization: Tin-plate over nickel barrier
- Note: Indicates EIA Preferred Case Sizes # Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk ca
- ±0.10pF J
- ±0.25pF K
- ±10% D
- ±0.5pF M
- ±20% F
- (GMV) G