HSM2694
Features
Low forward resistance. (rf = 0.9 max) Low capacitance. (C = 1.2p Fmax) MPAK package is suitable for high density surface mounting and high speed assembly.
+0.1 2.4 -0.1
SOT-23
2.9+0.1 -0.1
0.4+0.1 -0.1
0.95+0.1 -0.1 1.9+0.1 -0.1
A bsolute M axim um R atings T a = 25
P aram eter R everse V oltage P ow er dissipation Junction tem perature S torage tem perature O peration tem perature
Sym bol VR Pd Tj T stg Topr
V alue 35 150 125
-45 to +125 -20 to +60
U nit V m W
0-0.1 +0.1 0.38
-0.1
+0.1 1.3 -0.1
+0.1 0.97 -0.1
Unit: mm
0.1+0.05 -0.01
1.Base 2.Emitter 3.collector
Electrical Characteristics Ta = 25
P aram eter Reverse voltage Reverse current Forward voltage C a p a c ita n c e Forward resistance
Symbol
C o n d itio n s
M in
Typ
Max
U n it
IR = 10 A
VR = 25 V
50 n...
