FEATURES
Low forward resistance. (rf = 0.9 max) Low capacitance. (C = 1.2pFmax) MPAK package is suitable for high density surface mounting and high speed assembly. +0.1 2.4 -0.1 SOT-23 2.9+0.1 -0.1 0.4+0.1 -0.1 3 1 2 0.95+0.1 -0.1 1.9+0.1 -0.1 A bsolute M axim um R atings T a = 25 P aram eter R everse V oltage P ow er dissipation Junction tem perature S torage tem perature O peration tem perature Sym bol VR Pd Tj T stg Topr V alue 35 150 125 -45 to +125 -20 to +60 U nit V mW 0-0.1 +0.1 0.38 -0.1 +0.1 1.3 -0.1 +0.1 0.97 -0.1 0.55 0.4 Unit: mm 0.1+0.05 -0.01 1.Base 2.Emitter 3.collector ELECTRICAL CHARACTERISTICS
Ta = 25 P aram eter Reverse voltage Reverse current Forward voltage C a p a c ita n c e Forward resistance Symbol C o n d itio n s M in Typ Max U n it VR IR = 10 A 35 V IR VR = 25 V 50 nA VF IF = 10 mA 1.0 V C VR = 6 V, f = 1 MHz 1.2 pF rf IF = 2 mA, f = 100 MHz 0.9 Marking Marking B3 1