S-DSK13 Overview
Key Features
- Low profile package
- Ideal for automated placement
- Low power losses, high efficiency
- Low forward voltage drop
- High surge capability
- High temperature soldering： 260℃/10 seconds at terminals
- AEC-Q101 qualified Mechanical Date
- Case: SOD-123FL molded plastic
- Terminals: Solder plated, solderable per JESD22-B102D
