SP3012 Overview
The SP3012 Series integrates 6 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust devices can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (±8kV contact discharge) without performance...
SP3012 Key Features
- ESD, IEC 61000-4-2, ±12kV contact, ±25kV air
- EFT, IEC 61000-4-4, 40A (tP=5/50ns)
- Lightning, IEC 61000-4-5 2nd edition, 4A (tP=8/20μs)
- Low capacitance of 0.5pF (TYP) per I/O
- Low leakage current of 1.5μA (MAX) at 5V
- S mall form factor μDFN (JEDEC MO-229) package provides flow through routing to simplify PCB layout
- AEC-Q101 Qaulified
- Halogen free, lead free and RoHS pliant
- Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the opposite pin with the PCB trace
