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MD5811-D256-xxxx - Mobile Diskonchip P3

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M-Systems

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MD5811-D256-xxxx Mobile Diskonchip P3 by M-Systems - Datasheet Preview — Datasheet preview – MD5811-D256-xxxx

Datasheet Details

Part number	MD5811-D256-xxxx
Manufacturer	M-Systems
File Size	788.05 KB
Description	Mobile Diskonchip P3
Datasheet	MD5811-D256-xxxx Datasheet
Note	This datasheet PDF includes multiple part numbers: MD5811-D256-xxxx, MD5811-D256-V3Q18_M. Please refer to the document for exact specifications by model.
Additional preview pages of the MD5811-D256-xxxx datasheet.

Product details

Description

3.

Features

High capacity: 256Mbit (32MByte) Device cascading option: up to 1Gbit (128MByte) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 48-pin TSOP-I package 85-ball FBGA 7x10x1.2 mm package Enhanced performance with: Multi-plane operation DMA support MultiBurst operation Turbo operation Unrivaled data integrity with a robust Error Detection Code/Error Correction Code (EDC/ECC) Maximized flash endurance with TrueFFS® 6.1 (and hi.

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Other Datasheets by M-Systems

MD5811-D256-V3Q18 - Mobile Diskonchip P3

Published: Apr 14, 2009 |