• Part: MASW-004103-1365
  • Description: Silicon SP4T Surface Mount HMIC PIN Diode Switch
  • Category: Diode
  • Manufacturer: MACOM Technology Solutions
  • Size: 1.24 MB
Download MASW-004103-1365 Datasheet PDF
MACOM Technology Solutions
MASW-004103-1365
MASW-004103-1365 is Silicon SP4T Surface Mount HMIC PIN Diode Switch manufactured by MACOM Technology Solutions.
- Part of the MASW-004103-1365-MA comparator family.
Features - Operates 50 MHz to 20 GHz - Usable up to 26 GHz - Low Insertion Loss - High Isolation - Low Parasitic Capacitance and Inductance - Ro HS pliant Surmount Package - Rugged, Fully Monolithic - Glass Encapsulated Construction - Up to +38 d Bm C.W. Power Handling @ +25°C - Silicon Nitride Passivation - Polymer Scratch Protection - Solderable Functional Schematic Description The MASW-004103-1365 is a SP4T, surmount, broadband, monolithic switch using four sets of series and shunt connected PIN diodes. This device is designed for use in broadband, low to moderate signal, high performance, switch applications up to 20 GHz. It is a surface mountable switch configured for optimized performance and offers a distinct advantage over MMIC, beamlead and chip and wire hybrid designs. Because the PIN diodes of the MASW-004103-1365 are integrated into the chip and kept within close proximity, the parasitics typically associated with other designs that use individual ponents are kept to a minimum. To minimize the parasitics and achieve high performance the MASW-004103-1365 is fabricated using MAs’ patented HMIC™ (Heterolithic Microwave Integrated Circuit) process. This process allows the silicon pedestals, which form the series and shunt diodes or vias, to be imbeded in low loss, low dispersion glass. The bination of low loss glass and using tight spacing between elements results in an HMIC device with low loss and high isolation through low millimeter wave frequencies. The topside is fully encapsulated with silicon nitride and also has an additional layer of polymer for scratch and impact protection. The protective coating guards against damage to the junction and the anode airbridges during handling and assembly. On the backside of the chip gold metalized pads have been added to produce a solderable surmount device. J3 J4 J2 J5 J1 Pin Configuration Pin Function J1 RFC J2 RF1 J3 RF2 J4 RF3 J5 RF4 Ordering Information Part Number MASW-004103-13650G Package 50 piece...