MMP7089-127-1 Overview
The MMP7000‐127 MELF PIN diode series is manufactured using a proprietary diode process which optimizes the anode and cathode bonding area of the diode to the adjacent heat spreading metal posts within the ceramic package. This unique geometry provides lower electrical a nd within the surface mount package to provide higher average power performance to parable surface mount diode packages. With lower (<20 ºC/W), RF...
MMP7089-127-1 Key Features
- Ceramic Surface Mount Package
- Low RS <1 Ω (lower insertion loss & higher IIP3)
- Low Thermal Resistance <20°C/W for Higher
- Hermetically Sealed
- RoHS- pliant