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MA4FCP200 - Flip Chip PIN Diode

General Description

The MA4FCP200 is a silicon flip chip PIN diode fabricated using MACOM’s HMIC process which provides for repeatable electrical characteristics.

This diode is fabricated on epitaxial wafers using a process designed for extremely low parasitics.

Key Features

  •  Low Series Resistance  Low Capacitance  Fast Switching Speed  Silicon Nitride Passivation  Polymer Scratch Protection  RoHS Compliant.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MA4FCP200 Flip Chip PIN Diode Features  Low Series Resistance  Low Capacitance  Fast Switching Speed  Silicon Nitride Passivation  Polymer Scratch Protection  RoHS Compliant Description The MA4FCP200 is a silicon flip chip PIN diode fabricated using MACOM’s HMIC process which provides for repeatable electrical characteristics. This diode is fabricated on epitaxial wafers using a process designed for extremely low parasitics. The diode is fully passivated with silicon nitride to minimize leakage current. The chip also has an additional polymer layer for impact and scratch protection to prevent damage to the active area during handling. Applications The small outline and low 0.