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MA4FCP200 - Silicon Flip Chip PIN Diode

General Description

M/A-COM’s MA4FCP200 series is a silicon flip chip PIN diode fabricated with M/A-COM’s patented HMIC™ process.

This diode is fabricated on epitaxial wafers using a process designed for repeatable electrical characteristics and extremely low parasitics.

Key Features

  • Low Series Resistance Low Capacitance High Cut-off Frequency Silicon Nitride Passivation Polyimide Scratch Protection Designed for Automated Pick and Place Insertion Rugged by Design Surface Mountable Case Style ODS-12641, 2, 3 B G E A C D.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MA4FCP200 Silicon Flip Chip PIN Diode Features • • • • • • • • Low Series Resistance Low Capacitance High Cut-off Frequency Silicon Nitride Passivation Polyimide Scratch Protection Designed for Automated Pick and Place Insertion Rugged by Design Surface Mountable Case Style ODS-12641, 2, 3 B G E A C D Description M/A-COM’s MA4FCP200 series is a silicon flip chip PIN diode fabricated with M/A-COM’s patented HMIC™ process. This diode is fabricated on epitaxial wafers using a process designed for repeatable electrical characteristics and extremely low parasitics. This diode is fully passivated with Silicon Nitride and has an additional layer of Polyimide for scratch protection. These protective coatings prevent damage to the junction during automated or manual handling.