MA4P7452F-1072 Datasheet | MACOM Technology Solutions

Non Magnetic SMQ MELF PIN Diode Features - Non-Magnetic Package Suitable for MRI Applications - Rectangular MELF SMQ Ceramic Package - Hermetically Sealed - Low RS for Low Series Loss - Long t L for Lower Intermodulation Distortion - Low CJ for High Series Isolation - High Average Incident Power Handling - Ro HS- pliant Applications - Aerospace & Defense - ISM Description The MA4P7452F-1072T is a surface mountable PIN diode in a non-magnetic, Metal Electrode Leadless Faced (MELF) package. The device incorporates Mas’ time proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. Incorporated in the package is a hard glass passivated, CERMACHIP™ PIN chip that is full face bonded on both the cathode and anode to maximize surface area for the lowest electrical and thermal resistance. The package utilizes a non-magnetic plating process that provides for a package with extremely low permeability. This device has been prehensively characterized both electrically and mechanically to ensure repeatable & predictable performance. The nonmagnetic MA4P7452F-1072T is the electrical equivalent of its magnetic counterpart the MA4P7002F-1072T. This diode is well suited for use in low loss, low distortion, high power switching circuits and can be used in high magnetic field environments at HF through UHF frequencies. The low thermal resistance of this device provides excellent performance at high RF power incident levels, up to 100 watts CW. This device is designed to meet the most demanding electrical and mechanical MRI environments. Rev. V4 Designed for Automated Assembly These SMQ PIN diodes are designed for high volume tape and reel assembly. The rectangular package design provides for highly efficient automatic pick and place assembly techniques. The parallel flat surfaces are suitable for key jaw or vacuum pickup. All solderable surfaces are tin plated and patible with reflow and vapor phase soldering...