1N6376 Datasheet | MDE

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94 V-O - Glass passivated chip junction in Molded Plastic package - 1500W surge capability at 1ms - Excellent clamping capability - Low zener inpedance - Fast response time: typically less than 1.0 ps from 0 volts to BV min. - Typical IR less than 1µA above 10V - High temperature soldering guaranteed: 250°C/10 seconds/ .375", (9.5mm) lead length, 5lbs., (2.3kg) tension - Includes 1N6373 thru 1N6385 MECHANICAL DATA Case: JEDEC DO-201 Molded plastic Terminals: Plated Axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denoted positive end (cathode) except Bipolar Mounting Position: Any Weight: 0.045 ounces, 1.2 grams MAXIMUM RATINGS AND CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. RATING SYMBOL Peak Pulse Power Dissipation at TA = 25 °C, TP = 1ms (NOTE 1) PPPM Peak Pulse Current of on 10/1000 µs waveform (Note 1) Steady State Power Dissipation at TL = 75°C Lead lengths .375", 9.5mm (Note 2) IPPM PM(AV) Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed on Rated Load, (JEDEC Method)(Note 3) IFSM Maximum instantaneous forward voltage at 100A for unidirectional only Operatings and Storage Temperature Range TJ, TSTG VALUE Minimum 1500 SEE TABLE 1 3.5 -55 +175 UNITS Watts Amps Watts Amps Volt °C NOTES: 1. Non-repetitive current pulse, per Fig.3 and derated above Ta=25 °C per Fig.2. 2. Mounted on Copper Pad area of 0.8x0.8" (20x20mm) per Fig.5. 3. 8.3ms single half sine-wave, or equivalent square wave, Duty cycle=4 pulses per minutes maximum. Certified Ro HS pliant UL File # E223026 11/13/2013 MDE Semiconductor, Inc. 78-150 Calle Tampico, Unit 210, La Quinta, CA., USA 92253 Tel :...