MXC4007XC
Description
The MEMSIC Three-Axis Thermal Accelerometer is based on MEMSIC’s Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging.
Key Features
- Ultra Low Cost
- Most Advantaged Technology in Industry
- Monolithically-Integrated Single Chip MEMS
- MEMSIC Proprietary Technology with No
- >200,000g Shock Survival Rating of Sensing
- 12-bit Signal Output for X, Y and Z Axes
- Full Scale Range ±2g, ±4g and ±8g
- Smallest Wafer Level Package (WLP) Footprint
- 6-Position Orientation Detection
- Shake Detection with Interrupt
Applications
- Information Appliances – Cell Phones, Tablets, PDA’s, puter Peripherals
