TB1S Key Features
- Glass Passivated Chip Juntion
- Reverse Voltage
- 100 to 1000 V
- Forward Current
- High Surge Current Capability
- Designed for Surface Mount Application
- Case: ABS/LBF
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 88mg 0.0029oz
