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MT29F2G01AAAED - NAND Flash Memory

General Description

6 Architecture 7 Ball Assignments and Descriptions 8 Memory Mapping 10 Array Organization 10 Bus Operation 11 SPI Modes 11 CS# 11 SCK 11 HOLD#/SO3 11 SI/SO0 12 WP#/SO2 12 SO/SO1 12 SPI NAND Command Definitions 13 WRITE Operations 14 WRITE ENABLE (06h) 14 WRITE DISABLE (04h) 14 Featu

Key Features

  • Features.
  • Single-level cell (SLC) technology.
  • Organization.
  • Page size x1: 2112 bytes (2048 + 64 bytes).
  • Block size: 64 pages (128K + 4K bytes).
  • Plane size: 2 planes x 1024 blocks per plane.
  • Device size: 2Gb: 2048 blocks.
  • Data retention: 10 years.
  • New commands.
  • PAGE READ in x2 mode.
  • PAGE READ in x4 mode Options.
  • Density: 2Gb (single die).
  • Operating temperature.
  • Commercial (0°C to.

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Full PDF Text Transcription (Reference)

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Micron Confidential and Proprietary Advance‡ NAND Flash Memory Serial Peripheral Interface (SPI) MT29F2G01AAAED 2Gb x1: SPI NAND Flash Memory Features Features • Single-level cell (SLC) technology • Organization – Page size x1: 2112 bytes (2048 + 64 bytes) – Block size: 64 pages (128K + 4K bytes) – Plane size: 2 planes x 1024 blocks per plane – Device size: 2Gb: 2048 blocks • Data retention: 10 years • New commands – PAGE READ in x2 mode – PAGE READ in x4 mode Options • Density: 2Gb (single die) • Operating temperature – Commercial (0°C to +70°C) – Industrial (–40°C to +85°C) • Package – 63-ball VFBGA, lead-free, (9mm x 11mm) Table 1: NAND Flash SPI Parameters Parameters VCC range Frequency Transfer rate Loading throughput tBERS (BLOCK ERASE) tPROG (PAGE PROGRAM) tRD (PAGE READ) Inte