LX3055 Description
KEY FEATURES Microsemi’s InGaAs/InP PIN custom assembly configurations LX3055 single die Photo Diode chips are ideal for high including traditional wirebond or flip Coplanar Waveguide , 50Ω bandwidth 1310nm and 1550nm chip assembly High Responsivity optical networking applications. This device is ideal for Low Dark Current The device series offers high manufacturers of optical receivers, responsivity, low...
LX3055 Key Features
- LX3055 single die
- Coplanar Waveguide , 50Ω
- High Responsivity