LX3055 Overview
.Microsemi . Obsolete Product – not remended for new design LX3055 TM ® Coplanar InGaAs/InP PIN Photo Diode PRODUCTION DATA SHEET KEY FEATURES Microsemi’s InGaAs/InP PIN custom assembly configurations LX3055 single die Photo Diode chips are ideal for high including traditional wirebond or flip Coplanar Waveguide , 50Ω bandwidth 1310nm and 1550nm chip assembly High Responsivity optical networking applications. This device is ideal for Low...
LX3055 Key Features
- LX3055 single die
- Coplanar Waveguide , 50Ω
- High Responsivity