Datasheet Summary
®
Packaged and Bondable Chips
Features
- Low Series Resistance
- Fast Switching Speed
- Low Capacitance
- No Reverse Bias Required
- Available in Packages and Bondable Chips
- Available as Chip-on-Board ponents
Applications
- Switches
- Attenuators
- Phase Shifters
Maximum Ratings
Reverse Voltage Forward Current Incident Power Operating Temperature Storage Temperature
Breakdown Voltage 50 mA @ 25°C
+20 dBm @ 25°C -55°C to +175°C -55°C to +200°C
GaAs PIN DIODES
- MP61012
Description
Microsemi’s GaAs PIN diodes are fabricated utilizing a gold contact mesa and protected with silicon nitride. The diodes have short carrier lifetime for fast switching speed and low series...