8250ACZUMHB Datasheet | Motorola Semiconductor

Features ” Section 1.2, “Electrical and Thermal Characteristics” Section 1.2.1, “DC Electrical Characteristics” Section 1.2.2, “Thermal Characteristics” Section 1.2.3, “Power Considerations” Section 1.2.4, “AC Electrical Characteristics” Section 1.3, “Clock Configuration Modes” Section 1.3.1, “Local Bus Mode” Section 1.3.2, “PCI Mode” Section 1.4, “Pinout” Section 1.5, “Package Description ” Section 1.6, “Ordering Information” Page 2 5 5 10 10 11 19 19 22 28 53 56 The MPC8250 is available in two packages- the standard ZU package (480 TBGA) and an alternate VR package (516 PBGA)- as described in Section 1.4, “Pinout,” and Section 1.5, “Package Description .” For more information on VR packages, contact your Motorola sales office. Note that throughout this document references to the MPC8250 are inclusive of its VR version unless otherwise specified. NOTE: Document Revision History Changes to this document are summarized in Table 23 on page 56. Features Figure 1 shows the block diagram for...