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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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SWITCHMODE™ Power Rectifier
Using the Schottky Barrier principle with a proprietary barrier metal. These state–of–the–art devices have the following features: • Guardring for Stress Protection • Maximum Die Size • 150°C Operating Junction Temperature • Short Heat Sink Tab Manufactured – Not Sheared Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 1.7 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max.