MBRD1035CTL Description
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MBRD1035CTL/D Advance Information SWITCHMODE™ Schottky Power Rectifier DPAK Power Surface Mount Package . employing the Schottky Barrier principle in a large area metal to silicon power diode. State of the art geometry.
MBRD1035CTL Key Features
- Highly Stable Oxide Passivated Junction Guardring for Stress Protection Matched dual die construction
- May be Paralleled for High Current Output High dv/dt Capability Short Heat Sink Tap Manufactured
- Not Sheared Very Low Forward Voltage Drop Epoxy Meets UL94, VO at 1/8”
- Case: Epoxy, Molded
- Weight: 0.4 gram (approximately)
- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
- Shipped in 75 units per plastic tube
- Available in 16 mm Tape and Reel, 2500 units per Reel, Add “T4’’ to Suffix part #
- Marking: B1035CL MAXIMUM RATINGS