MBRS1540T3 Description
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MBRS1540T3/D Advance Information Surface Mount Schottky Power Rectifier SMB Power Surface Mount Package . employing the Schottky Barrier principle in a metal to silicon power rectifier.
MBRS1540T3 Key Features
- pact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over-V
- Case: Molded Epoxy
- Epoxy Meets UL94, VO at 1/8″
- Weight: 95 mg (approximately)
- Polarity: Notch in Plastic Body Indicates Cathode Lead
- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
- Available in 12 mm Tape, 2500 Units per 13″ Reel, Add “T3” Suffix to Part Number
- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
- Marking: BGJ MAXIMUM RATINGS
- 55 to +150