MMSZ5242B Datasheet | Multicomp

Surface Mount Zener Diode Features : -   Planar Die Construction -   500mW Power Dissipation -   General Purpose, Medium Current -   Ideally Suited for Automated Assembly Processes Applications: -   Zener diode -   Ultra-small surface mount package Maximum Rating @ Ta = 25°C unless otherwise specified Characteristic Symbol Value Forward voltage @ IF=10mA Power dissipation Pd 500 Thermal resistance, junction to ambient air RθjA Junction temperature Tj 150 Storage temperature range Tstg -65 to +150 Note : D evice mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2. Tested with pulses, Tp ≤ 1ms. Unit V mW °C/W °C °C Electrical Characteristics @ Ta =...