MMSZ5248B - Surface Mount Zener Diode

Multicomp

General Description

Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it.

Key Features

Planar Die Construction.
500mW Power Dissipation.
General Purpose, Medium Current.
Ideally Suited For Automated Assembly Processes.

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MMSZ5248B surface mount zener diode by Multicomp - Datasheet Preview

Datasheet Details

Part number	MMSZ5248B
Manufacturer	Multicomp
File Size	299.62 KB
Description	Surface Mount Zener Diode
Datasheet	MMSZ5248B Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Surface Mount Zener Diode Features: • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited For Automated Assembly Processes Applications: • Zener diode • Ultra-small surface mount package Maximum Rating @ Ta = 25°C unless otherwise specified Characteristic Symbol Value Forward voltage Power dissipation @ IF=10mA VF PD 0.9 500 Thermal resistance, junction to ambient air RθjA 350 Junction temperature Tj 150 Storage temperature range Tstg -65 to +150 Note : Device mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2. Tested with pulses, Tp ≤ 1ms.