Datasheet Summary
Surface Mount
Zener Diode
Features
:
- Planar Die Construction
- 500mW Power Dissipation
- General Purpose, Medium Current
- Ideally Suited For Automated Assembly Processes
Applications:
- Zener diode
- Ultra-small surface mount package
Maximum Rating @ Ta = 25°C unless otherwise specified
Characteristic
Symbol
Value
Forward voltage Power dissipation
@ IF=10mA
VF PD
0.9 500
Thermal resistance, junction to ambient air
RθjA
Junction temperature
Tj 150
Storage temperature range
Tstg -65 to +150
Note : Device mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2. Tested with pulses, Tp ≤ 1ms.
Unit V mW °C/W
°C °C
Electrical Characteristics...
