LDH544N00KAB-700 Datasheet Chip Multilayer Delay Lines

Manufacturer: Murata Manufacturing

Overview: !Note •PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmoouunntitninggaannddhhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc. N91E7.pdf 03.5.13 •TThhisisccaatatalologghhaassoonnlylytytyppiciacal sl pspeecicficfiactaiotinosn.sTbheecraeufosree,thyeorueaisrenroeqsupeascteedfotrodaeptapirloevdesopuercpifircoadtuiocnt ss.pTehceifirceafotioren,spoleratosetranpsparocvt ethoeuarppprroodvuacl tsshpeeectifoicraptiroondsucotrstrpaencsifaiccatitohnesabpepfororevaolrsdheerientgf.or product specifications before ordering. Chip Multilayer Delay Lines Chip Multilayer Delay Lines 1 3.2±0.2 1.1±0.2 1.60±0.2 0.25+0.1/-0.15 0.5±0.1 This Delay Line was developed by applying ceramic (3) (2) (1) multilayering and hole technology. It consists of copper line and low dielectric constant material and incorporates metal shields. LDH series are very small (4) (8) (5) (6) (7) 0.25+0.1/-0.15 and made for use at high frequencies. 0.35±0.2 0.45±0.

This datasheet includes multiple variants, all published together in a single manufacturer document.

Datasheet Details

Part number	LDH544N00KAB-700
Manufacturer	Murata Manufacturing
File Size	220.61 KB
Description	Chip Multilayer Delay Lines
Datasheet	LDH544N00KAB-700 LDH-311N Datasheet (PDF)

Key Features

(1)(3)(5)(7) : NC (2)(6) : GND (4)(8) : IN/OUT 1. High stability at high frequency (2GHz) 0.5±0.1 1.0±0.1 (in mm) 2. Small, thin and light, utilizing multilayer construction m3. Metal shield is built inside chip. 4. Reflow solderable o5. Supplied on tape Sheet4U. c0.6±0.1 . DataDirectional Input Mark (1) (2) (3) (8) (4) (7) (6) (5) 0.4±0.2 4.5±0.2 3.2±0.2 2.2±0.1 0.3±0.2 0.1±0.1 2.0±0.1 1.1±0.2 wwwLDH43 Series 0.35±0.10 1.27±0.10 (1)(3)(4)(5)(7)(8) : GND (2)(6) : IN/OUT (in mm).

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