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UPC8172TB - SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

General Description

The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage.

This IC is manufactured using NEC’s 30 GHz fmax.

UHS0 (Ultra High Speed Process) silicon bipolar process.

Key Features

  • Recommended operating frequency : fRFout = 0.8 to 2.5 GHz.
  • Higher IP3.
  • High-density surface mounting.
  • Supply voltage : CG = 9.5 dB TYP. , OIP3 = +7.5 dBm TYP. @ fRFout = 0.9 GHz : 6-pin super minimold package : VCC = 2.7 to 3.3 V.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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PRELIMINARY DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8172TB SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC’s 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conventional µPC8106TB, but operates at higher frequency, higher gain and lower distortion. Consequently this IC is suitable for mobile communications. FEATURES • Recommended operating frequency : fRFout = 0.8 to 2.5 GHz • Higher IP3 • High-density surface mounting • Supply voltage : CG = 9.5 dB TYP., OIP3 = +7.5 dBm TYP. @ fRFout = 0.