Datasheet4U Logo Datasheet4U.com

UPD5702TU - 3V OPERATION SILICON LDMOSFET RF POWER AMPLIFIER INTEGRATED CIRCUIT

General Description

and 2.4 GHz applications.

This IC consists of two stage amplifiers.

The device is packaged in surface mount 8 pin L2MM (Lead Less Mini Mold) plastic package.

Key Features

  • Output Power : Pout = +21 dBm MIN. @Pin =.
  • 5 dBm, f = 1.9 GHz, VDS = 3.0 V : Pout = +21 dBm MIN. @Pin = +2 dBm, f = 2.45 GHz, VDS = 3.0 V.
  • Single Supply voltage : VDS = 3.0 V TYP.
  • Packaged in 8-pin Lead-Less Minimold (2.0 x 2.2 x 0.5mm) suitable for high-density surface mounting.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
UPD5702TU Si LD MOS POWER AMPLIFIER CEL
UPD5710TK SINGLE CONTROL CMOS SPDT SWITCH CEL
UPD5713TK WIDE BAND SPDT SWITCH CEL
UPD5713TK WIDE BAND SPDT SWITCH Renesas
UPD5739T7A SiGe CMOS Renesas

Other Datasheets by NEC (now Renesas Electronics)

Part Number Description
UPD5710TK WIDE BAND SPDT SWITCH
UPD5715GR CMOS MMIC 4 x 2 IF SWITCH MATRIX
UPD5716GR CMOS MMIC 4 x 2 IF SWITCH MATRIX
UPD5738T6N WIDE BAND DPDT SWITCH
UPD5747T6J LOW NOISE AND HIGH GAIN AMPLIFIER

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
PRELIMINARY DATA SHEET Si LDMOSFET ANALOG RF INTEGRATED CIRCUIT µPD5702TU 3V OPERATION SILICON LDMOSFET RF POWER AMPLIFIER INTEGRATED CIRCUIT FOR 1.9 GHz PHS AND 2.4 GHz APPLICATIONS DESCRIPTION The µPD5702TU is a silicon laterally diffused (LD) MOSFET IC designed for use as power amplifier 1.9 GHz PHS and 2.4 GHz applications. This IC consists of two stage amplifiers. The device is packaged in surface mount 8 pin L2MM (Lead Less Mini Mold) plastic package. FEATURES • Output Power : Pout = +21 dBm MIN. @Pin = −5 dBm, f = 1.9 GHz, VDS = 3.0 V : Pout = +21 dBm MIN. @Pin = +2 dBm, f = 2.45 GHz, VDS = 3.0 V • Single Supply voltage : VDS = 3.0 V TYP. • Packaged in 8-pin Lead-Less Minimold (2.0 x 2.2 x 0.5mm) suitable for high-density surface mounting. APPLICATIONS • 1.